先進聚?亞胺材料--合成表徵及應用(英文版)(精)/先進電子封裝技術與關鍵材料叢書
內容大鋼
先進聚?亞胺材料，由於具有優異的耐熱性、綜合力學性能、電學性能和化學穩定性等，在航空、航天、微電子、平面顯示、電氣絕緣等高技術領域具有廣泛的應用前景。
本書系統介紹了先進聚?亞胺材料的合成、性能和應用。包括先進聚?亞胺薄膜、先進聚?亞胺纖維、碳纖維複合材料用樹脂基體、超級工程塑料和泡沫材料、微電子用聚?亞胺材料，還介紹了氣體分離膜、質子交換膜、可溶性和低k值聚?亞胺材料。
本書可供化學工業、高分子材料、航空航天、微電子製造與封裝、平面顯示等領域的相關研究人員、工程師、研究生以及高年級的本科生參考使用。
作者介紹
編者:楊士勇|責編:吳剛|總主編:汪正平//劉勝//朱文輝
楊士勇，中國科學院化學研究所研究員、高技術材料實驗室主任；1982年于蘭州大學獲得學士學位，1985年于中國科學院化學研究所獲碩士學位，1988年于南開大學獲得博士學位；1988?1992年在中國科學院上海有機化學研究所任助理研究員，1992年3月?1996年5月年在美國紐約州立大學布法羅分校及芝加哥大學從事博士后研究，1996年至今在中國科學院化學研究所先後任副研究員、研究員。多年來一直從事耐高溫聚?亞胺材料的基礎及應用基礎研究，發表研究論文200余篇，申請發明專利100余項，獲得授權專利70多項。
目錄
Preface ix
List of Contributors xi
About the Editor xii
Chapter 1 Advanced Polyimide Films
Shi-Yong Yang and Li-Li Yuan
1.1 Introduction
1.2 Chemistry of Polyimide Films
1.2.1 Thermal Imidization
1.2.2 Chemical Imidization
1.3 Thermal Curing of Polyimide Films
1.3.1 Thermal Imidization Process
1.3.2 Influence of Curing Temperatures on Film』s Properties
1.4 Structures and Properties of Polyimide Films
1.4.1 Advanced Polyimide Films
1.4.2 Low-CTE Polyimide Films
1.4.3 Transparent Polyimide Films
1.4.4 Atomic Oxygen-resistant Polyimide Films
1.5 Surface Modification of Polyimide Films
1.6 Applications of Polyimide Films
1.6.1 Electric Insulating Applications
1.6.2 Electronic and Optoelectronic Applications
1.6.3 Aerospace Applications
1.7 Summary
REFERENCES
Chapter 2 Advanced Polyimide Fibers
Qing-Hua Zhang, Jie Dong and De-Zhen Wu
2.1 Introduction
2.2 Synthesis of Spinning Resin Solutions
2.2.1 「Two-Step」 Polymerization Method
2.2.2 「One-Step」 Polymerization Method
2.3 Preparation of Polyimide Fibers
2.3.1 Wet-Spinning Method
2.3.2 Dry-Spinning Method
2.3.3 Other-Spinning Methods
2.4 Structure and Properties of Polyimide Fibers
2.4.1 Aggregation Structure of Polyimide Fibers
2.4.2 Chemical Structure-Property Relationship
2.4.3 Properties of Polyimide Fibers
2.5 Applications of Polyimide Fibers
2.5.1 Production of Polyimide Fibers
2.5.2 Application of Polyimide Fibers
2.6 Summary
REFERENCES
Chapter 3 Polyimide Matrices for Carbon Fiber Composites
Shi-Yong Yang and Mian Ji
3.1 Introduction
3.2 NA-endcapped Thermoset Matrix Resins
3.2.1 Chemistry
3.2.2 Structures and Properties
3.3 PE-endcapped Oligoimide Resins
3.3.1 Chemistry
3.3.2 Structures and Properties
3.4 Properties of Polyimide/Carbon Fiber Composites
3.4.1 Preparation of PMR-type Resin Prepregs
3.4.2 Fabrication of Carbon Fiber Composites
3.4.3 Properties of NA-Endcapped Polyimide Composites by Autoclave
3.4.4 Properties of PE-Endcapped Polyimide Composites by Autoclave
3.4.5 Properties of PE-Endcapped Polyimide Composites by RTM
3.5 Applications of Polyimide/Carbon Fiber Composites
3.6 Summary
REFERENCES
Chapter 4 Super Engineering Plastics and Foams
Shi-Yong Yang, Hai-Xia Yang and Ai-Jun Hu
4.1 Introduction
4.2 Compression-Molded Polyimide Materials
4.3 Injection and Extrusion Processed Polyimide Materials
4.4 Structures and Melt Processabilities of Aromatic Polyimide Resins
4.4.1 Polyimide Backbone Structures
4.4.2 Controlled Molecular Weights
4.5 Meltable Thermoplastic Polyimide Composites
4.6 Reactive End-Capped Meltable Polyimide Resins
4.6.1 NA-end-capped Meltable Polyimide Resins
4.6.2 PE-end-capped Meltable Polyimide Resins
4.7 Heat-Resistant Polyimide Foams
4.7.1 Introduction
4.7.2 Opened-Cell Soft Polyimide Foams
4.7.3 Closed-Cell Rigid Polyimide Foams
4.8 Thermally Stable Flexible Polyimide Aerogels
4.9 Summary
REFERENCES
Chapter 5 Polyimides for Electronic Applications
Qing-Hua Lu and Feng Zheng
5.1 Introduction
5.2 Polyimide Materials for Microelectronics
5.2.1 Combined Property Requirements
5.2.2 Typical Applications
5.2.3 Structures and Properties of Polyimide Materials for Microelectronics
5.3 Polyimide Materials for Optoelectric Planar Displays
5.3.1 Liquid Crystal Alignment Layers
5.3.2 Mechanical Rubbing Alignment Polyimides
5.3.3 Photoinduced Alignment PIs
5.3.4 The Microgroove Polyimide Surfaces
5.3.5 Langmuir–Blodgett Polyimide Films
5.4 Polyimide Materials for Optoelectronic Flexible Displays
5.4.1 Combined Property Requirements
5.4.2 Polyimides for Flexible Electronic Substrates
5.5 Polyimide Materials for Electronic Memories
5.5.1 Introduction
5.5.2 Polyimides for Resistive-type Memory Devices
5.5.3 Polyimides for Transistor-type Memory Devices
5.6 Summary
REFERENCES
Chapter 6 Polyimide Gas Separation Membranes
Xiao-Hua Ma and Shi-Yong Yang
6.1 Introduction
6.2 Mechanisms of Gas Separation and Testing Methods
6.2.1 Gas Transport Mechanism
6.2.2 Apparatus for Testing Gas Transport Properties
6.3 Structures and Properties of Polyimide Membranes
6.3.1 Isomer Structure Effects From Diamines
6.3.2 Substitution and Geometric Effects From Diamines
6.3.3 Chemical Structure Effects of Dianhydrides
6.4 Intrinsically Microporous Polyimide Membranes
6.5 Hydroxyl-functionalized Polyimide and Its Derived Polybenzoxazole Membranes
6.5.1 Hydroxyl-functionalized Polyimide Membranes
6.5.2 Thermally Rearranged Polybenzoxazole (TR-PBO) Membranes
6.5.3 Applications of TR-PBO Contents Membranes
6.6 Polyimide-Derived Carbon Molecular Sieve Membranes
6.6.1 Formation of CMSMs
6.6.2 Conversion From Polyimide to CMSMs
6.6.3 Structures and Properties of CMSMs
6.7 In Summary
REFERENCES
Chapter 7 Polyimide Proton Exchange Membranes
Jian-Hua Fang
7.1 Introduction
7.2 Monomer Synthesis
7.2.1 Synthesis of Sulfonated Diamines
7.2.2 Synthesis of Six-membered Ring Dianhydrides
7.3 Polyimide Preparations
7.3.1 Preparation From Sulfonated Diamines
7.3.2 Preparation From Sulfonated Dianhydrides
7.3.3 Synthesis via Postsulfonation
7.3.4 Block Copolymerization
7.4 Ion Exchange Membrane Properties
7.4.1 Solubility
7.4.2 Thermal Stability
7.4.3 Water Uptake and Swelling Ratios
7.4.4 Proton Conductivity
7.4.5 Water Resistance
7.4.6 Radical Oxidative Stability
7.4.7 Methanol Permeability
7.5 Fuel Cell Performance
7.6 Summary
REFERENCES
Chapter 8 Soluble and Low-k Polyimide Materials
Yi Zhang and Wei Huang
8.1 Introduction
8.2 Structures and Properties of Soluble Aromatic Polyimides
8.2.1 Soluble Polyimides With Flexible Backbones
8.2.2 Soluble Polyimides With Asymmetric Structures
8.2.3 Soluble Polyimides With Alicyclic Structures
8.2.4 Soluble Polyimides With Side Groups
8.3 Applications of Soluble Aromatic PIs
8.3.1 Second-order Nonlinear Optical (NLO) Materials
8.3.2 Memory Device Materials
8.3.3 Compensator Materials for Liquid Crystal Displays
8.3.4 Gas Separation Materials
8.3.5 Other Applications
8.4 Low-k Polyimide Materials
8.4.1 Introduction
8.4.2 Impact Factors on Dielectric Properties
8.4.3 Structures and Dielectric Properties of Polyimides
8.4.4 Low-k Polyimides With Porous Structures
8.4.5 Organic-Inorganic Hybrid Polyimide Materials
8.4.6 Intrinsic Low-k Polyimide Materials
8.4.7 Summary
REFERENCES
Appendix Unit of Measurement Conversion Table
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